The Role of Automated Test Equipment (ATE)Deliverables in ‎Effective Failure Analysis

Authors

  • Amrutha Sampath Texas A&M University, College Station, Texas

DOI:

https://doi.org/10.14419/v2d1q011

Published

19-05-2026

Keywords:

Automated Test Equipment (ATE); Failure Analysis (FA); Semiconductor Diagnostics; Parametric ‎and Functional Testing; Machine Learning Integration.

Abstract

In the semiconductor industry, where reliability, yield, and performance are the key competitive ‎factors, the ATE plays a pivotal role. It enables high-speed and highly accurate testing and prepares ‎outputs such as a test log, waveform capture, diagnostic reports, and yield statistics necessary for ‎successful failure analysis (FA). It also helps identify signatures of failure, isolate the defect sites, ‎and correlate suspicious test-based abnormalities with their root causes. Parametric and functional ‎aberrations, and thus ATE generation and verification, have become major tools for engineers to ‎correlate complex defect behaviors with behavioral-phase-level defects that are generally ‎overlooked if one simply relies on a traditional inspection system. Future integration of ATE data ‎into advanced analytics and machine learning will also contribute to a proactive and prospective ‎approach to FA. There remain numerous challenges today, however, in dealing with big data, ‎delivering diagnostic resolution, and sustaining diagnostic methodology for new architectures such ‎as 3D ICs and advanced nodes. This paper discusses the roles of ATE deliverables in FA and ‎addresses the latest developments, bottlenecks, and future directions toward improving diagnostic ‎resolution and product quality assurance‎.

References

Ooi, M. P. L., Kuan, S. H., Kuang, Y. C., Cheng, H., Sim, E. K. J., Demidenko, S. N., & Chan, C. W. K. (2013). Identifying systematic failures on semiconductor wafers using ADCAS. IEEE Design & Test, 30(5), 44-53. https://doi.org/10.1109/MDAT.2013.2253151.

Zhan, W., Zhou, Y., Zheng, J., Cai, X., Zhang, Q., & Wen, X. (2025). A Method for Grading Failure Rates Within the Dynamic Effective Space of Integrated Circuits After Testing. Applied Sciences, 15(4), 2009. https://doi.org/10.3390/app15042009.

Grabill, N., Wang, S., Olayinka, H. A., De Alwis, T. P., Khalil, Y. F., & Zou, J. (2024). AI-augmented failure modes, effects, and criticality analysis (AI-FMECA) for industrial applications. Reliability engineering & system safety, 250, 110308. https://doi.org/10.1016/j.ress.2024.110308.

Xu, Y., Wang, S., Feng, Q., Xia, J., Li, Y., Li, H. D., & Wang, J. (2024). scCAD: Cluster decomposition-based anomaly detection for rare cell identi-fication in single-cell expression data. Nature Communications, 15(1), 7561. https://doi.org/10.1038/s41467-024-51891-9.

Yang, J., Bai, R., Ji, H., Zhang, Y., Hu, J., & Feng, S. (2025). Adaptive testing environment generation for connected and automated vehicles with dense reinforcement learning. IEEE Transactions on Intelligent Transportation Systems. https://doi.org/10.1109/TITS.2025.3535866.

Iranshahi, K., Brun, J., Arnold, T., Sergi, T., & Müller, U. C. (2025). Digital twins: Recent advances and future directions in engineering fields. Intel-ligent Systems with Applications, 26, 200516. https://doi.org/10.1016/j.iswa.2025.200516.

Weber, A. (2020). Smart manufacturing in the semiconductor industry: An evolving nexus of business drivers, technologies, and standards. In Smart Manufacturing (pp. 59-105). Elsevier. https://doi.org/10.1016/B978-0-12-820028-5.00003-5.

Moosavi, S., Razavi-Far, R., Palade, V., & Saif, M. (2024). Explainable artificial intelligence approach for diagnosing faults in an induction furnace. Electronics, 13(9), 1721. https://doi.org/10.3390/electronics13091721.

Davletshin, A., Ko, L. T., Milliken, K., Periwal, P., Wang, C. C., & Song, W. (2020, December). Object Detection in SEM Images Using Convolu-tional Neural Networks: Application on Pyrite Framboid Size-Distribution in Fine-Grained Sediments. In AGU Fall Meeting Abstracts (Vol. 2020, pp. IN028-07).

Kumar, P. (2025) Next-generation secure authentication and access control architectures: advanced techniques for securing distributed systems in modern enterprises. International Journal of Computational and Experimental Science and ENgineering (IJCESEN) Vol. 11-No.3, pp. 4966-4995. https://doi.org/10.22399/ijcesen.3294.

Koblah, D., Acharya, R., Capecci, D., Dizon-Paradis, O., Tajik, S., Ganji, F., ... & Forte, D. (2023). A survey and perspective on artificial intelli-gence for security-aware electronic design automation. ACM transactions on design automation of electronic systems, 28(2), 1-57. https://doi.org/10.1145/3563391.

Orloff, J. (1993). High‐resolution focused ion beams. Review of Scientific Instruments, 64(5), 1105-1130. https://doi.org/10.1063/1.1144104.

Goldstein, J. I., Newbury, D. E., Michael, J. R., Ritchie, N. W., Scott, J. H. J., & Joy, D. C. (2017). Scanning electron microscopy and X-ray microa-nalysis. springer. https://doi.org/10.1007/978-1-4939-6676-9.

Ghosh, J. (2024). Efficient machine learning-assisted failure analysis method for circuit-level defect prediction. Machine Learning with Applications, 16, 100537. https://doi.org/10.1016/j.mlwa.2024.100537.

Kathiresan, G. (2024). Adaptive Test Optimization: Using Reinforcement Learning to Improve Software Testing Strategies. Well Testing Journal, 33(S2), 715-732.

Pan, J., Low, K. L., Ghosh, J., Jayavelu, S., Ferdaus, M. M., Lim, S. Y., ... & Thean, A. V. Y. (2021). Transfer learning-based artificial intelligence-integrated physical modeling to enable failure analysis for 3 nanometer and smaller silicon-based CMOS transistors. ACS Applied Nano Materials, 4(7), 6903-6915. https://doi.org/10.1021/acsanm.1c00960.

Zhuohan, L. I., Yiliang, Y. O. U., Zihua, Z. H. A. O., Hongyun, L. U. O., Sujun, W. U., Zheng, Z. H. A. N. G., & Qunpeng, Z. H. O. N. G. (2024). Application of artificial intelligence technology in failure analysis. Journal of Aeronautical Materials, 44(5).

Bai, R., Chen, R., Lei, X., & Wu, K. (2024). A test report optimization method fusing reinforcement learning and genetic algorithms. Electronics, 13(21), 4281. https://doi.org/10.3390/electronics13214281.

Chang, Y. J., Liu, C. H., Lin, Y. S., Wang, C. C., Liu, N., Chiu, B., & Gu, A. (2024, October). A Correlative Microscopic Workflow Powered by Artificial Intelligence to Accelerate Failure Analysis of Next-Generation Semiconductor Packages. In International Symposium for Testing and Failure Analysis (Vol. 84918, pp. 312-316). ASM International. https://doi.org/10.31399/asm.cp.istfa2024p0312.

Chen, H., Zhang, X., Huang, K., & Koushanfar, F. (2023). Adatest: Reinforcement learning and adaptive sampling for on-chip hardware trojan detec-tion. ACM Transactions on Embedded Computing Systems, 22(2), 1-23. https://doi.org/10.1145/3544015.

Kumar, P. (2024). AI-Powered Fraud Prevention in Digital Payment Ecosystems: Leveraging Machine Learning for Real-Time Anomaly Detection and Risk Mitigation. Journal of Information Systems Engineering and Management 2024, 9(4) e-ISSN: 2468-4376

Gohil, V., Patnaik, S., Guo, H., Kalathil, D., & Rajendran, J. (2022, July). DETERRENT: Detecting trojans using reinforcement learning. In Pro-ceedings of the 59th ACM/IEEE Design Automation Conference (pp. 697-702). https://doi.org/10.1145/3489517.3530518.

Chen, Y. L., Sacchi, S., Dey, B., Blanco, V., Halder, S., Leray, P., & De Gendt, S. (2024). Exploring machine learning for semiconductor process optimization: a systematic review. IEEE Transactions on Artificial Intelligence. https://doi.org/10.1109/TAI.2024.3429479.

How to Cite

Sampath, A. . (2026). The Role of Automated Test Equipment (ATE)Deliverables in ‎Effective Failure Analysis. International Journal of Basic and Applied Sciences, 14(8), 693-701. https://doi.org/10.14419/v2d1q011

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