Probe Array from BeCu Metal Sheet Using Heat and Fusing Currents

  • Authors

    • Sangwon Kim
    • Chanseob Cho
    • Bonghwan Kim
    https://doi.org/10.14419/ijet.v7i3.7.16346

    Received date: July 26, 2018

    Accepted date: July 26, 2018

    Published date: July 4, 2018

  • BeCu, probe array, heat current, fusing current

  • Abstract

    A probe array fabricated from a beryllium-copper metal sheet was developed in order to produce cost-effective microelectromechanical system (MEMS) probe cards. The probe array is fabricated via a simple, inexpensive process in which a heat current is used for annealing and a fusing current from a DC power supply is used for cutting the metal sheet. The stress relaxation time was 7 min during the application of a 4 A heat current, and the fusing current was 20 A. The contact force was approximately 1 gram force at a deflection of 100 μm, and the contact resistance from the tip of the probe to the end of the probe beam was 1.9 Ω. The probe array is suitable for use in probe cards, test sockets, and various types of manufacturing equipment.

  • References

    1. M. Beiley, J. Leung, S. S. Wong, A Micromachined Array Probe Card-Characterization. IEEE Trans. Compon., Packag., Manuf. Technol. 1995, 18, 184–191.
    2. Y. Zhang, Y. Zhang, R. B. Marcus, Thermally Actuated Micro-probes for a New Wafer Probe Card. IEEE J. Microelectromech. Syst. 1999, 8, 43–49.
    3. T. Itoh, S. Kawamura, T. Suga, K. Kataoka, Development of an Electrostatically Actuated MEMS Switching Probe Card. Proceed-ings of the 50th IEEE Holm Conference on Electrical Contacts and the 22nd International Conference on Electrical Contacts, Se-attle, WA, USA, Sept 20–23, 2004, pp 226–230.
    4. T. Namazu, S. Inoue, Y. Tashiro, Y. Okamura, K. Koterazawa, Ti-Ni SMA Film Actuated Si Cantilever Beams for MEMS Probe Card. Proceedings of the 13th International Conference on Solid-State Sensors, Actuators, and Microsystems, Seoul, South Korea, June 5–9, 2005, pp 733–736.
    5. K. Lee, B. Kim, J. Micromech. Microeng. 2007, 15, 937.
    6. Y.-M. Kim, H.-C. Yoon, J.-H. Lee, Silicon Microprobe Card Using Porous Silicon Micromachining Technology. ETRI J. 2005, 27, 433–438.
    7. K. Kataoka, S. Kawamura, T. Itoh, T. Suga, K. Ishikawa, H. Honma, Low Contact-Force and Compliant MEMS Probe Card Utilizing Fritting Contact. Proceedings of the 15th IEEE Interna-tional Conference on Micro Electro Mechanical Systems, Las Ve-gas, NV, USA, Jan 20–24, 2002, pp 364–367.
    8. B.-H. Kim, S.-J. Park, K. Chun, D. Cho, W.-K. Park, T.-U Jun, S. Yun, A Fine Pitch MEMS Probe Unit for Flat Panel Display as Manufacturing MEMS Application. Sens. Actuators 2004, 115, 46–52.
    9. N. L. Tracy, R. Rothenberger, C. Copper, N. Corman, G. Biddle, Array Sockets and Connectors Using Microspring Technology. 2000 IEEE/CMPT International Electronics Manufacturing Tech-nology Symposium, Santa Clara, CA, USA, Oct 3, 2000, pp 129–140.
    10. T. Hantschel, L. Wong, C.L. Chua, D. K. Fork, Fabrication of Highly Conductive Stressed-Metal Springs and Their Use as Slid-ing-Contact Interconnects. Microelectron. Eng. 2003, 67–68, 690–695.
    11. X. Jing, D. Chen, X. Chen, J. Miao, J. Liu, J. Zhu, Design and Fabrication of a Micromachined Bilayer Cantilever Probe Card. J. Micro/Nanolithog., MEMS, MOEMS 2010, 9, 043005.
    12. C. Tsou, S. L. Huang, H. C. Li, T. S. Lai, Electroplated Nickel Mi-cromachined Probe with Out-of-Plane Predeformation for IC Chip Testing. J. Micromech. Microeng. 2006, 16, 2197–2202.
    13. D. Lee, S. Kim, D. Kong, C. Cho, B. Kim, B. Lee, J. Lee, Fabrica-tion of BeCu Module Probe Array Using Heating and Fusing Cur-rents. Proceedings of the 10th Annual IEEE Conference on Sen-sors, Limerick, Ireland, Oct 28–31, 2011, pp 1732–1735.
    14. D. Lee, S. Kim, D. Kong, C. Cho, B. Kim, J. Lee, O. Kwon, Fab-rication of BeCu Probe Array Using Heating and Fusing Current. Proceedings of the 24th International Microprocesses and Nano-technology Conference, Kyoto, Japan, Oct 17–24, 2011.
    15. B.-H. Kim, J.-B. Kim, J.-H. Kim, A Highly Manufacturable Large Area Array MEMS Probe Card Using Electroplating and Flipchip Bonding. IEEE Trans. Ind. Electron. 2009, 56, 1079–1085.
    16. B.-H. Kim, H.-C. Kim, K. Chun, J. Ki, Y. Tak, Cantilever-Type Microelectromechanical Systems Probe Card with Through-Wafer Interconnects for Fine Pitch and High-Speed Testing. Jpn. J. Appl. Phys. 2004, 43, 3877–3881.
    17. C. Cho, S. Kim, D. Kong, J. Nam, B. Kim, J. Lee, Design and Fabrication of Highly Manufacturable Microelectromechanical Systems Test Sockets for Ball Grid Array Integrated Circuit Pack-ages. Jpn. J. Appl. Phys. 2011, 50, 06GM17.
    18. S. Kim, Fabrication of Probe Array with Beryllium Copper Sheet Using Joule Heating and Fusing. Master’s Thesis, Kyungpook Na-tional University, December 2010.

  • Downloads

  • How to Cite

    Kim, S., Cho, C., & Kim, B. (2018). Probe Array from BeCu Metal Sheet Using Heat and Fusing Currents. International Journal of Engineering and Technology, 7(3.7), 182-186. https://doi.org/10.14419/ijet.v7i3.7.16346