Design of Double-E Shaped Metamaterial Structure with Negative µ and ? for Enhancement of Patch Antenna Parameters, “This paper has been withdrawn”

  • Authors

    • Bimal Garg Madhav Institute of Technology Gwalior (India)
    • Tilak Chitransh Madhav Institute of Technology Gwalior (India)
    • Ankit Samadhiya Madhav Institute of Technology Gwalior (India)
    https://doi.org/10.14419/ijet.v1i3.125

    Received date: June 15, 2012

    Accepted date: July 3, 2012

    Published date: July 10, 2012

  • Abstract

    In this paper RMPA along with Double-E Shaped resonator as a metamaterial structure is proposed at a height of 3.2mm from the ground plane. Rectangular microstrip patch antenna along with the proposed metamaterial structure is designed to resonate at 1.944GHz, which exhibits -21.976dB return loss at operating frequency and has impedance bandwidth from 1.933 to 1.958GHz. The return loss and impedance bandwidth of the patch antenna along with the proposed metamaterialstructure is improved by 11.876dB and 19.1MHz respectively. All the simulation work is done by using CST-MWS Software. Here Nicolson-Ross-Weir method (NRW) has been used to verify Double-Negative properties (Negative Permeability and Permittivity) of the proposed metamaterial structure.

    Author Biographies

    • Bimal Garg, Madhav Institute of Technology Gwalior (India)
      Associate Professor in Electronics Department
    • Tilak Chitransh, Madhav Institute of Technology Gwalior (India)
      I am pursuing Masters of Engineering in communication control and networking branch (Electronics Department)
    • Ankit Samadhiya, Madhav Institute of Technology Gwalior (India)
      I am pursuing Masters of Engineering in communication control and networking branch (Electronics Department)

  • References

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  • How to Cite

    Garg, B., Chitransh, T., & Samadhiya, A. (2012). Design of Double-E Shaped Metamaterial Structure with Negative µ and ? for Enhancement of Patch Antenna Parameters, “This paper has been withdrawn”. International Journal of Engineering and Technology, 1(3), 256-265. https://doi.org/10.14419/ijet.v1i3.125