KIM, Moonjung. Effect of electromagnetic interference shield on package and PCB. International Journal of Engineering & Technology, [S. l.], v. 7, n. 4, p. 6398–6401, 2019. DOI: 10.14419/ijet.v7i4.17963. Disponível em: https://www.sciencepubco.com/index.php/ijet/article/view/17963.. Acesso em: 29 apr. 2024.