Thermal analysis of metal-ceramic bonding using finite element method

  • Authors

    • S. Gopinath Tagore Engineering College
    • R Sabarish Bharath University
    • R. Sasidharan
    2014-04-26
    https://doi.org/10.14419/ijet.v3i2.1830

  • This paper reports a finite element study of effect of bonding strength between metal and ceramic. The bonding strength is evaluated with different processing temperature and holding time. The difference between the coefficients of linear thermal expansion (CTEs) of the metal and ceramic induces thermal stress at the interface. The mismatch thermal stress at the interface region plays an important role in improving bonding strength. Hence, it is essential to evaluate the interface bonding in metal-ceramics joints. The Al/SiC bonding was modeled and analyzed using finite element analysis in ANSYS (v.10).

     

    Keywords: Bonding Strength, Coefficient of Thermal Expansion, Thermal Stress, Interface, Al/Sic, FEA.

  • References

    1. G.G.Sozhamannan, S.BalasivanandhaPrabu, (2009) “Influence of interface compounds on interface bonding characteristics of aluminium and silicon carbide”, Materials Characterization, vol 51, pp1044- 5803.
    2. S.BalasivanandhaPrabu, et al (2004) “A Finite Element analysis study of micromechanical interfacial characteristics of metal matrix composites”, Journal of Materials Processing Technology, 153-154, pp 992-997.
    3. A. Bendada, et al (2004), “Analysis of thermal contact resistance between polymer and mold in injection molding, Applied Thermal engineering”, vol 24, pp 2029–2040.
    4. Vishal Singha, et al (2005), “An experimentally validated thermomechanical model for the prediction of thermal contact conductance”, Applied Thermal Engineering, vol 48, pp 5446–5459.
    5. F. Lau a, et al, (1998) “A study of the interfacial heat transfer between an iron casting and a metallic mould”, Journal of Materials Processing Technology 79 25–29 6.
    6. Yongyi Zhu, (1999), “Thermal Contact Development”, Applied Thermal Engineering, vol677, pp 1654- 1232.
    7. A.M. Khounsary, et al, (1997), “Thermal Contact resistance across a copper-silicon interface”, Advanced photon source, vol.604, pp 60439-4843
    8. A.M.S. Hamouda, M.S.J. Hashrni, (1996) “Mechanical properties of aluminium metal matrix composites under impact loading”, Journal of Materials Processing Technology 56 pp 743-756
    9. M. Kemal Apalak, Recep Gunes, (2002) “On non-linear thermal stresses in an adhesively bonded single lap joint”, Computers and Structures vol 80, pp 85–98.

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  • How to Cite

    Gopinath, S., Sabarish, R., & Sasidharan, R. (2014). Thermal analysis of metal-ceramic bonding using finite element method. International Journal of Engineering & Technology, 3(2), 216-219. https://doi.org/10.14419/ijet.v3i2.1830